POSITION SUMMARY

The Field Process Engineer position is located in Arizona and supports the business objectives of HTA’s Semiconductor Equipment Division (SED) at the customer site.  This position will require the employee to be at the customer site ~80% of the time.  The main objective of this position is to provide process engineering support to SED’s various customer activities and development programs associated with plasma etchers and Reactive Ion Etch (RIE) processes.  Training will be given to develop specific skills and knowledge.  The employee must be willing to travel to Asia for a training assignment if necessary.  The engineer should be able to independently perform tasks, understand RIE theory, work in a cleanroom environment, and interface with customers on a detailed level.  The engineer is also interfacing with engineers globally so strong interpersonal skills are required.

 PRIMARY RESPONSIBILITIES

• Day-to-Day responsibilities include: completing assigned tasks in a timely fashion, develop good customer relations, troubleshooting customer process issues, working closely with the customer to understand needs and reporting back to SED, manage and drive projects to closure.
• Perform hands-on RIE/dry etch process troubleshooting and development. This includes performing troubleshooting and  demonstrations at the customer site, R&D of new dry etch technology trends, and meeting the objectives of customer requirements for current and future technology processes. 
• Perform etch process development to support productivity programs related to meeting the targeted customer specifications. This includes interacting with the customer to understand needs, making process and dry clean adjustments, and achieving defectivity and process stability specs.
• Utilize analytical tools & techniques to solve process development issues.
• Analysis of data, design and execution of experiments including DOE.
• After training, must be able to operate Hitachi plasma etch systems and all associated semiconductor metrology equipment including scanning electron microscopy, focused ion beam milling, and thin film metrology techniques.
• Working under supervision, must be able to complete process development tasks after receiving instructions.
• Generate internal and external documentation for products, presentations, and technical reports, and generate process engineering specifications.
• Interface with customers regarding demonstration results, new product evaluations, training of process and/or equipment, and troubleshooting of process issues.

EDUCATION, LICENSES, AND/OR CERTIFICATION REQUIREMENTS

• BS Degree in Chemical Engineering, Materials Science, Physics, related field, or equivalent experience.

EXPERIENCE AND TRAVEL REQUIREMENTS

• 0-5 years Plasma Etch Process Experience or semiconductor processing preferred.
• Possible travel to Japan for training or customer sites worldwide as needed

SKILLS AND ABILITIES REQUIREMENTS

• Periodic oversees business trips may be required throughout the year.
• Strong general technical knowledge of semiconductor wafer processing.
• Fundamental understanding of and experience with Dry Etch / RIE.
• Self-motivated and show ability to adapt to changes in a fast moving environment.
• Strong knowledge of chemistry, the ability to analyze OES data, and utilize other predictive software is required.
• Strong engineering analytical/problem solving skills. Understanding of scientific method and experience using it.
• In depth knowledge of Design of Experiments (DOE).
• Candidate must have good verbal and written communication, strong analytical capabilities and trouble shooting skills, and must work well in a team environment.
• Demonstrate project planning, execution, and leadership skills with on-time delivery of milestones.
• Ability to work independently.
• Strong troubleshooting skills required.
• Must be able to work in a clean room environment for extended hours.
• Strong computer skills including Microsoft Office software competency.

SAFETY REQUIREMENTS

• Job Related Knowledge Wire training
• Additional training to handle acids, bases or gases used for dry etching as needed

Warning:  Due to the nature of the work environment, this job may require working on equipment or in work areas where electromagnetic frequencies may be present from some of the equipment (intensity may vary) which could possibly interfere with certain medical implants or devices. If you have questions, contact Human Resources.